Kandou AI, a Swiss semiconductor company that builds chip-to-chip interconnect technology, has raised $225 million in what it calls a Series A round, led by Maverick Silicon with strategic participation from SoftBank, Synopsys, Cadence Design Systems, and Alchip Technologies. The round values the co
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https://thenextweb.com/news/kandou-ai-225m-copper-interconnect-ai-infrastructureTags:#technology#the-next-web
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